Product detailed description

3DXSTAT™ ESD-SAFE ABS 3D Filament

Target surface resistance: 10^7 to 10^9 Ohm.  Compare to Stratasys® ABS-ESD7 in performance and price and you'll never go back!  Made using cutting-edge multi-wall carbon nanotube technology, state of the art compounding technology, and precision extrusion processes.

3DXSTAT™ ESD ABS is an advanced ESD-Safe compound designed for use in critical applications that require electrostatic discharge (ESD) protection and a high level of cleanliness.  Manufactured with consistency in mind - 3DXTech starts with premium ABS and then compounded according to a proprietary formulation of multi-wall carbon nanotubes - giving you a filament with excellent printing characteristics and consistent ESD properties.  

Typical applications include:

• Semi-con:  HDD Components, Wafer Handling, Jigs, Casings, & Connectors 
• Industrial:  Conveying, Metering, and Sensing applications

Target conductivity for 3DXSTAT™ ESD ABS:  

• 10^7 to 10^9 Ohm surface resistivity on 3DP sample using concentric ring method.
• Note:  Internal studies have indicated that increased extruder temperatures can achieve higher levels of conductivity.  Likewise, lower extruder temperatures have resulted in lower levels of conductivity. Each printer is set-up differently as well as varied part geometry.  Therefore, expect some trial time to understand how this filament works in your specific printer / application.

 Surface conductivity as a function of extruder temperature:

The surface resistance of the printed ESD-safe part will vary depending on the printer's extruder temperature.  For example, if your testing indicates the part is too insulative, then increasing the extruder temperature will result in improved conductivity.  Therefore, the surface resistance can be 'dialed-in' by adjusting the extruder temperature up or down depending on the reading you receive on your part.  

Filament Specifications:

1.75mm and 2.85mm +/- 0.05mm in diameter

 Recommended Print Conditions:

• Extruder: 220-240°C
• Bed Temp: 100-110°C
• Bed Prep: Magigoo Bed Prep Adhesive and 3DXTECH Polyimide Tape work best for us.
• Heated Chamber: Recommended, a chamber helps reduce warping.
• Other: Increasing your extrusion multiplier up to 1.15 or even 1.2 and varying your fan speed between 50-100% may be necessary.
• Supports: Water soluble AquaTek X1 USM works great for complex parts.
• Drying Instructions: 80°C for 4 hours.